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Powered by Huawei Kunpeng processors, this server board for next-generation data centers uses high-speed CPU interconnect HCCS technology and PCIe 4.0 for much higher bandwidth.
Patented ultra-low-loss and ultra-high-density technologies enable high-speed, high-bandwidth DIMM interconnections. In addition to CPU socket-free welding of up to 32 DIMM slots of high-density memory, industry-compliant soft/hardware interfaces accelerate the entire system development cycle.
Leading 56 Gbit/s high-speed SerDes (HSS) for 25% higher motherboard performance
Signal bit error rate (BER) lower than 10-12 for 15% fewer failures than the industry average
Innovative Dynamic Energy Management Technology (DEMT) for over 15% better efficiency than the industry counterpart
|Processors||2 Kunpeng 920 processors|
|Internal Storage||Up to 16 x 3.5" SAS/SATA HDDs or SSDs, or 16 x 2.5" NVMe SSDs|
|Memory||Up to 32 DDR4-2933 DIMMs|
|PCIe Expansion||8 PCIe 4.0 x8, or 3 PCIe 4.0 x16 + 2 PCIe 4.0 x8|
|LOM Network Ports||2 LOM NICs, supporting GE/10GE/25GE|
|Management Module||1 Hi1710 intelligent management chip|