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CH221 V5 provides superior computing and PCIe expansion capabilities. It runs on the new-generation Intel® Xeon® Scalable processors, provides 24 DIMM slots, and supports 2 PCIe expansion cards and 2 x 2.5-inch hard disk drives (HDDs) or solid-state drives (SSDs). It is ideal for scenarios such as video rendering, AI, and HPC.
Powered by new-generation Intel® Xeon® Scalable processors, supports up to 28 compute cores per CPU, provides 2 standard full-height half-length PCIe slots, and supports Intel® Turbo Boost and Hyper-Threading technologies to deliver a leap in compute performance.
Uses the Dynamic Energy Management Technology (DEMT) and power-capping technology to achieve optimal power consumption control, significantly reducing power consumption during low-load operation.
Supports full-lifecycle intelligent management, greatly improving deployment and O&M efficiency, provides standardized open interfaces and development guides to facilitate seamless integration with third-party management software.
Huawei E9000 Helps PCSS of Poland Build an HPC TOP100 Supercomputing Center
PCSS uses the Direct Liquid Cooling System based on the Huawei E9000 blade server to dissipate over 80% of the system heat. The solution enables a Power Usage Effectiveness (PUE) of 1.1, drives down system energy consumption by 40%, improves computing density by 60%, and slashes OPEX for PCSS, successfully positioning PCSS on the HPC TOP100 list.
|Form Factor||Full-width, 2-socket compute node|
|Processors||1 or 2 Intel® Xeon® Scalable processors|
|Memory||24 DDR4 DIMMs|
|Internal Storage||2 x 2.5-inch SSDs or SAS/SATA HDDs; 2 NVMe SSD disks
Or up to 4 M.2 SSDs (SATA interface), individually hot-pluggable
|RAID Support||RAID 0, 1, 5, 6, or 10|
|PCIe Expansion||2 mezzanine cards (x16) and 2 full-height half-length standard cards (one PCIe x16 and one PCIe x8)|
|Operating Temperature||5ºC to 40ºC (41ºF to 104ºF)|
|Dimensions (H x W x D)||60.46 mm x 423 mm x 537.2 mm (2.38 in. x 16.65 in. x 21.15 in.)|
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