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CH225 V3

FusionServer CH225 V3 All-Flash Compute Node

The CH225 V3 provides superior computing performance and large storage capacity. It uses Intel® Xeon® E5-2600 v3/v4 series processors and supports up to 24 DIMM slots, 12 x 2.5-inch NVMe SSDs, and 2 x 2.5-inch hard disks. The CH225 V3 is suitable for scenarios that require high computing performance and large storage capacity, such as high-performance databases, real-time data analysis, and search.

Huawei server with Intel^®Xeon^®processor.
Intel, the Intel Logo, Intel Inside, Intel Core, and Core Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

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Ultra-large NVMe Flash memory capacity for the upcoming all-Flash era

Supports up to 12 x 2.5-inch NVMe SSDs and 2 x 2.5-inch SAS/SATA HDDs or SSDs, delivering up to 9,600,000 IOPS. Delivers industry-leading NVMe storage capacity per node
Supports the full series and all specifications of Intel® Xeon® E5-2600 v3/v4 processors. Provides 2 x 22-core processors to deliver superior computing capability
Complies with IPMI V2.0 and supports remote deployment and fault locating methods. Supports remote maintenance using SOL, KVM over IP, virtual CD-ROM drive, and WebUI to reduce O&M costs
Provides efficient and secure power consumption analysis and control capabilities. SSDs can be separately unloaded on the OS

Specifications

Form Factor	Full-width, 2-socket compute node
Number of Processors	1 or 2
Processor Model	Intel^® Xeon^® E5-2600 v3/v4 series
Memory	24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB
Local Storage	12 x 2.5-in. NVMe SSDs and 2 x 2.5-in. SAS/SATA HDDs or SSDs
Intra-Board Storage	2 x Mini-SSDs (SATA DOM) 2 x Micro-SD cards (RAID 1) 1 x USB Flash drive (USB 3.0)
RAID	2 x 2.5-in. SAS/SATA HDDs or SSDs (RAID 0 or 1)
PCIe Expansion	4 x mezzanine cards (x16)
Operating Temperature	5ºC to 40ºC (41ºF to 104ºF)