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CH225 V5 provides excellent compute capability and ultra-large storage. It uses the new-generation Intel® Xeon® Scalable processors, provides 24 DIMM slots, and supports 12 x 2.5-inch HDDs or NVMe SSDs and 2 x 2.5-inch hard drives. It applies to high-performance databases, real-time data analytics, and search services.
Powered by Intel® Xeon® Scalable processors, supporting 12 HDDs or NVMe SSDs and 2 SAS/SATA HDDs or SSDs, delivers industry-leading NVMe storage capacity for a single node, and uses the 3UPI interconnect design to provide higher storage bandwidth.
Uses the Dynamic Energy Management Technology (DEMT) and power capping technology to achieve optimal power consumption control, significantly reducing power consumption during low-load operation.
Supports full-lifecycle intelligent management, greatly improving deployment and O&M efficiency, and provides standardized open interfaces and development guides to facilitate seamless integration with third-party management software.
Huawei E9000 Helps PCSS of Poland Build an HPC TOP100 Supercomputing Center
PCSS uses the Direct Liquid Cooling System based on the Huawei E9000 blade server to dissipate over 80% of the system heat. The solution enables a Power Usage Effectiveness (PUE) of 1.1, drives down system energy consumption by 40%, improves computing density by 60%, and slashes OPEX for PCSS, successfully positioning PCSS on the HPC TOP100 list.
|Form Factor||Full-width, 2-socket compute node|
|Processors||1 or 2 Intel® Xeon® Scalable processors|
|Memory||24 DDR4 DIMMs|
|Internal Storage||12 NVMe SSDs or SAS/SATA HDDs, supporting mixed configuration of HDDs and SSDs
2 x 2.5-inch SSDs or SAS/SATA HDDs, or up to 6 M.2 SSDs (2 on-board)
|RAID Support||RAID 0, 1, 5, 6, 10, 50, or 60|
|PCIe Expansion||4 mezzanine cards (x16)|
|Operating Temperature||5ºC to 40ºC (41ºF to 104ºF)|
|Dimensions (H x W x D)||60.46 mm x 423 mm x 537.2 mm (2.38 in. x 16.65 in. x 21.15 in.)|
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