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CH221 V5 provides superior computing and PCIe expansion capabilities. It runs on the new-generation Intel® Xeon® Scalable processors, provides 24 DIMM slots, and supports 2 PCIe expansion cards and 2 x 2.5-inch Hard Disk Drives (HDDs) or Solid-State Drives (SSDs). It is ideal for scenarios such as video rendering, AI, and HPC.
Powered by new-generation Intel® Xeon® Scalable processors, supports up to 28 compute cores per CPU, provides 2 standard full-height half-length PCIe slots, and supports Intel® Turbo Boost and Hyper-Threading technologies to deliver a leap in compute performance.
Uses the Dynamic Energy Management Technology (DEMT) and power-capping technology to achieve optimal power consumption control, significantly reducing power consumption during low-load operation.
Supports full-lifecycle intelligent management, greatly improving deployment and O&M efficiency, provides standardized open interfaces and development guides to facilitate seamless integration with third-party management software.
PCSS uses the Direct Liquid Cooling System based on the Huawei E9000 blade server to dissipate over 80% of the system heat. The solution enables a Power Usage Effectiveness (PUE) of 1.1, drives down system energy consumption by 40%, improves computing density by 60%, and slashes OPEX for PCSS, successfully positioning PCSS on the HPC TOP100 list.
|Form Factor||Full-width, 2-socket compute node|
|Processors||1 or 2 Intel® Xeon® Scalable processors|
|Memory||24 DDR4 DIMMs|
|Internal Storage||2 x 2.5-inch SSDs or SAS/SATA HDDs; 2 NVMe SSD disks
Or up to 4 M.2 SSDs (SATA interface), individually hot-pluggable
|RAID Support||RAID 0, 1, 5, 6, or 10|
|PCIe Expansion||2 mezzanine cards (x16) and 2 full-height half-length standard cards (one PCIe x16 and one PCIe x8)|
|Operating Temperature||5ºC to 40ºC (41ºF to 104ºF)|
|Dimensions (H x W x D)||60.46 mm x 423 mm x 537.2 mm (2.38 in. x 16.65 in. x 21.15 in.)|