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FusionServer CH225 V3 All-Flash Compute Node

The CH225 V3 provides superior computing performance and large storage capacity. It uses Intel® Xeon® E5-2600 v3/v4 series processors and supports up to 24 DIMM slots, 12 x 2.5-inch NVMe SSDs, and 2 x 2.5-inch hard disks. The CH225 V3 is suitable for scenarios that require high computing performance and large storage capacity, such as high-performance databases, real-time data analysis, and search.


Huawei server with Intel® Xeon® processor.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

Ultra-large NVMe Flash memory capacity for the upcoming all-Flash era

  • Supports up to 12 x 2.5-inch NVMe SSDs and 2 x 2.5-inch SAS/SATA HDDs or SSDs, delivering up to 9,600,000 IOPS. Delivers industry-leading NVMe storage capacity per node
  • Supports the full series and all specifications of Intel® Xeon® E5-2600 v3/v4 processors. Provides 2 x 22-core processors to deliver superior computing capability
  • Complies with IPMI V2.0 and supports remote deployment and fault locating methods. Supports remote maintenance using SOL, KVM over IP, virtual CD-ROM drive, and WebUI to reduce O&M costs
  • Provides efficient and secure power consumption analysis and control capabilities. SSDs can be separately unloaded on the OS

Specifications

Form Factor

Full-width, 2-socket compute node

Number of Processors

1 or 2

Processor Model

Intel® Xeon® E5-2600 v3/v4 series

Memory

24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB

Local Storage

12 x 2.5-in. NVMe SSDs and 2 x 2.5-in. SAS/SATA HDDs or SSDs

Intra-Board Storage

2 x Mini-SSDs (SATA DOM)

2 x Micro-SD cards (RAID 1)

1 x USB Flash drive (USB 3.0)

RAID

2 x 2.5-in. SAS/SATA HDDs or SSDs (RAID 0 or 1)

PCIe Expansion

4 x mezzanine cards (x16)

Operating Temperature

5ºC to 40ºC (41ºF to 104ºF)

WORLDWIDE

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Worldwide

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