Get Pricing/Info Get Quote Forum Contact Us

Total: 0 products

  • Choose product to compare

Cancel
Compare with CISCO
Compare with H3C
  • Choose product to compare

Cancel
Compare with CISCO
Compare with H3C
  • Choose product to compare

Cancel
Compare with CISCO
Compare with H3C
  • Choose product to compare

Cancel
Compare with CISCO
Compare with H3C

Select Region

FusionServer CH140L V3 Compute Node

Optimized for HPC and dense computing enterprise services, the liquid cooled CH140L V3 provides ultra-high computing capabilities. A half-width slot supports two 2-socket compute nodes; each node can be maintained independently. The CH140L V3 uses Intel® Xeon® E5-2600 v3/v4 series processors, supports eight DIMM slots and one hard disk, as well as 2 built-in Micro-SD slots supporting RAID 1.


Huawei server with Intel® Xeon® processor.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

Facilitates ultra-high computing density for enterprise services with easy management and energy savings

  • Supports the full series of Intel® Xeon® E5-2600 v3/v4 processors to deliver up to 2 x 22-core of computing capacity; a half-width slot supports two small slots in two layers for installing two independent 2- socket compute nodes
  • Reduces O&M costs by enabling remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant
  • Provides efficient, secure power consumption analysis and control capabilities. Complies with Intel® NM 3.0. Supports an intelligent and secure power-off mode for compute nodes
  • Supports board-level liquid cooling; adopts integrated cooling plates without internal solder points; 80% of heat dissipated through liquid; supports individually maintainable CPUs and memory modules

Specifications

Form Factor

Two 2-socket, twin compute nodes in a half-width slot

Number of Processors

1 or 2 in each 2-socket compute node

Processor Models

Intel® Xeon® E5-2600 v3/v4 series

Number of DIMMs

8 DDR4 DIMMs for each 2-socket compute node

Number of Hard Disks

One 2.5-inch SSD/SATA for each 2-socket compute node

RAID Support

N/A

PCIe Expansion

2 twin nodes share 2 Mezz modules

OS Support

Microsoft Windows Server 2008/2012

Red Hat Enterprise Linux

SUSE Linux Enterprise Server

Oracle Linux

CentOS

Citrix XenServer

VMware

Operating Temperature

5°C to 35°C

Dimensions

Height: 60.46 mm (2.38 in.)

Width: 210 mm (8.27 in.)

Depth: 537.2 mm (21.15 in.)

WORLDWIDE

Huawei Enterprise APP
Worldwide

Copyright © 2017 Huawei Technologies Co., Ltd. All rights reserved.