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FusionServer CH121L V5 Liquid-Cooled Compute Node

As the liquid-cooled version of the CH121 V5 blade, CH121L V5 has been optimized for services such as virtualization, cloud computing, HPC, and Network Functions Virtualization (NFV). It delivers high-density compute power and ultra-large memory capacity. Running on the latest-generation Intel® Xeon® Scalable Processors, it supports the entire processor family with power consumption of up to 205W. CH121L V5 provides 24 DDR4 DIMM slots and supports two 2.5-inch hard drives or four M.2 SSDs.

Huawei server with Intel® Xeon® Scalable processor.
Intel, the Intel Logo, Intel Inside, Intel Core, and Core Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

Key Features

Efficient Liquid Cooling, Superb Performance, Smart Management

  • Board-level liquid cooling and cabinet-level air-to-liquid heat exchange combined to eliminate the need for row air-conditioners and water chillers, with a cooling PUE less than or equal to 1.1 and cooling power consumption down by 90%
  • Powered by the new-generation Intel® Xeon® Scalable Processors, with up to 28 compute cores per processor; supports 24 DIMM slots, up to 3 TB DDR4 memory, and 4 M.2 SSDs, enabling service acceleration on demand
  • Provides entire-lifecycle smart O&M to drive greater deployment and O&M efficiency; provides standardized, open interfaces and supports RESTful APIs and the IPMI 2.0 standard, facilitating seamless integration with third-party management software


Form Factor

2-socket liquid-cooled blade server in a half-width slot


1 or 2 Intel® Xeon® Scalable Processors of up to 205 W


24 DDR4 DIMM slots, with memory speeds of up to 2,666 MT/s, and memory capacity of up to 3 TB

Internal Storage

2 x 2.5-inch SSDs, or SAS/SATA hard drives; 2 NVMe SSDs supported

Or up to 4 M.2 SSDs (SATA interface), individually hot-swappable

RAID Support

2 x 2.5-inch SSDs or SAS/SATA hard drives; supports RAID 0 or 1

4 M.2 SSDs; supports RAID 0, 1, 10, 5, or 6

PCIe Expansion

2 mezzanine cards (x16)

Operating Systems

Microsoft Windows Server 2008/2012

Red Hat Enterprise Linux

SUSE Linux Enterprise Server

Oracle Linux


Huawei FusionSphere

Citrix XenServer


Operating Temperature

5ºC to 40ºC (41ºF to 104ºF), compliant with ASHRAE CLASS A3

Dimensions (H x W x D)

60.46 mm x 215 mm x 525 mm (2.38 in. x 8.46 in. x 20.67 in.)


Huawei Enterprise APP

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